The spotlight of the Oerlikon Manmade Fibers segment’s Egy Stitch & Tex 2020 attendance will be on two core technologies: the new generation of Oerlikon Barmag eAFK Evo texturing machines is to be unveiled within the African market for the very first time.
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Yarn producers can now also achieve these typical WINGS properties with ACW winders – with a corresponding system upgrade.
With up to 700 potential filaments per yarn end, the BCF S8 is raising the benchmark considerably compared to the Oerlikon Neumag S+ BCF system (400 filaments) that has dominated the global market to date.
Single-end Sytec One is recommended for processes with high breakage rates, fine filaments, frequent colour changes or in general when demanding processes take up an increasing share in the business.
The market for the production of carpet yarn is increasingly evolving towards more demanding processes. However, beyond commodity products, standard plants can no longer fully exploit their advantages. From March 20-22, 2018, Oerlikon Neumag presented an economical alternative in Shanghai in hall W3, booth F03 at the Domotex asia/Chinafloor, the leading floor covering trade fair in the Asia-Pacific region: the BCF plant Sytec One with single-end technology.
“The manmade fibre (MMF) market has recovered in the last three months from the two impacts of demonetisation and GST,†said Andre Wissenberg, Vice President, Head of Marketing, Corporate Communications and Public Affairs, Oerlikon, while speaking on the challenges for the manmade fibre industry in a global environment.
Sytec One is a BCF plant with only one end per position, which is particularly well suited for demanding production processes.
Cost-efficient production of carpet yarns beyond commodity products can constitute a challenge. Highly standardised production systems must strike compromises with regard to throughput, quality or cost-efficiency.
Oerlikon Barmag will be showcasing its gear metering pump program specifically designed for the joining/binding work steps at this year’s Bondexpo, the international trade fair for bonding technology, to be held from October 9 to 12, 2017 at Stuttgart, Germany.