After the successful introduction at the ITMA in Milan, SSM will show their latest technologies and inventions for the first time in Asia. Special focus lies on the new XENO-platform with the enhanced DIGICONE® 2 winding algorithm, enabling a 10 to 20 per cent increase on dye package density with same dyeing recipe. For the first time ever the SSM X-Series will be shown to the public. The machinesâ€â€TWX-W/D, PWXW and PSX-W/Dâ€â€are the most economised winding solution, reduced to the max yet maintaining highest flexibility for any cost efficient winding application.